For demanding applications where highly flexible, impact-resistant bonds are required, Master Bond has developed Polymer System EP37-3FLF.
This optically clear, two-component epoxy has exceptional resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a superb potting, encapsulating, and casting system, especially where wider cross-section thicknesses are specified. Its combination of properties allows it to cure without stressing delicate electronic components.
Serviceable over the range of 4K to 250° F, EP37-3FLF cures at room temperature in two to three days or faster at elevated temperatures. This epoxy offers a convenient, non-critical 1 to 1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 to 1,500 cps. Additionally, users can work with a 100 gram mass of the adhesive at room temperature for up to 90 minutes.
EP37-3FLF has a bond shear strength exceeding 2,000 psi and a T-peel strength of 25 pli. This flexible epoxy has an elongation of 180% and superior electrical insulation properties with a volume resistivity of 1×1014 ohm-cm. It bonds well to a variety of substrates including metals, glass, ceramics, rubbers and many plastics. It is sold in pint, quart, gallon, and five-gallon container kits and has a six-month shelf life if unopened and stored at room temperature.
Learn more at www.masterbond.com/lp/tabs/tp_pp_lowstress.html, or phone 201-343-8983, or e-mail [email protected].
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